Comparison Table: DDR5 vs DDR4 vs HBM3 Memory
Memory Specifications
Specification
DDR5
DDR4
HBM3
Number of DIMMs
1, 2, or 4
1, 2, or 4
N/A
Channel Width
64-bit
64-bit
1024-bit per stack
Data Transfer Rate
Up to 51.2 GB/s (per channel)
Up to 25.6 GB/s (per channel)
Up to 665 GB/s per stack
Total Bandwidth
Up to 102.4 GB/s (quad-channel)
Up to 51.2 GB/s (dual-channel)
Up to 2.66 TB/s per package
Clock Speed
Up to 6400 MHz or higher
Up to 3200 MHz or higher
N/A
Voltage
1.1V-1.5V
1.2V
1.2V
Latency
Lower
Higher
Lower
Capacity
4GB-64GB
4GB-64GB
Up to 32GB per stack, up to 16 stacks per package
Applications
Servers, high-performance computing
Desktops, laptops, gaming, consumer electronics
Graphics processing, machine learning, scientific computing
Explanation of Specifications
Number of DIMMs per channel: This refers to the number of Dual In-line Memory Modules (DIMMs) that can be installed in a single memory channel. The more DIMMs that can be installed, the more memory can be added to a system, which can improve performance.
Channel width: This refers to the width of the data bus between the memory and the processor. The wider the channel, the more data can be transferred at once, which can improve performance.
Data transfer rate per module and per channel: This refers to the speed at which data can be transferred between the memory and the processor. The higher the data transfer rate, the faster the memory can transfer data, which can improve performance.
Total bandwidth: This refers to the amount of data that can be transferred between the memory and the processor in a given amount of time. The higher the total bandwidth, the more data can be transferred, which can improve performance.
Clock speed: This refers to the speed at which the memory operates. The higher the clock speed, the faster the memory can transfer data, which can improve performance.
Voltage: This refers to the amount of electrical power required to operate the memory. Lower voltage can result in lower power consumption and heat dissipation, which can improve energy efficiency and system stability.
Latency: This refers to the time it takes for the memory to respond to a request from the processor. Lower latency can improve performance by reducing the amount of time the processor has to wait for data.
Capacity: This refers to the amount of data that can be stored in the memory module. Higher capacity can improve performance by allowing for larger datasets to be processed at once.
Common Applications
- DDR5: Mainstream desktop and laptop computers , gaming systems, high-performance servers, data centers.
- DDR4: Desktop and laptop computers, gaming systems, servers, data centers, mobile devices.
- HBM3: Graphics processing units (GPUs), artificial intelligence/machine learning systems, high-performance computing (HPC) applications.